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Feedthru 0805/1206 Capacitors
W2F/W3F Series
Common Ground
L
S
X
Feedthru Pad
CL
Feedthru Pad
BL
DIMENSIONS
BW
T
Common Ground
EW
W
L
W
T
BW BL
EW
X
S
0805 MM
(in.)
1206 MM
(in.)
2.01 ± 0.20
(0.079 ± 0.008)
3.20 ± 0.20
(0.126 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
1.14 Max.
(0.045 Max.)
1.27 Max.
(0.050 Max.)
0.46 ± 0.10 0.18 + 0.25 -0.08
(0.018 ±0.004) (0.007 + 0.010 -0.003)
0.89 ± 0.10 0.18 + 0.25 -0.08
(0.035 ± 0.004) (0.007 + 0.010 -0.003)
0.25 ± 0.13
(0.010 ± 0.005)
0.38 ± 0.18
(0.015 ± 0.007)
1.02 ± 0.10
(0.040 ± 0.004)
1.60 ± 0.10
(0.063 ± 0.004)
0.23 ± 0.15
(0.009 ± 0.006)
0.46 ± 0.15
(0.018 ± 0.006)
T
P
P
C
S
L
W
RECOMMENDED SOLDER PAD LAYOUT (TYPICAL DIMENSIONS)
T
P
S
W
L
C
0805 MM
(in.)
1206 MM
(in.)
3.45
(0.136)
4.54
(0.179)
0.51
(0.020)
0.94
(0.037)
0.76
(0.030)
1.02
(0.040)
1.27
(0.050)
1.65
(0.065)
1.02
(0.040)
1.09
(0.043)
0.46
(0.018)
0.71
(0.028)
TYPICAL FEEDTHRU CHIP CAP CONNECTION
Feedthru Chip Component Model
Physical Layout - A
Vcc or
Signal In
Vcc or
Signal Out
Signal In
Ground
Signal Out
Ground
Ground
The terminals are connected internally side to side.
Left side and right side are connected and front and
back are connected internally.
For Decoupling, the chip is usually surrounded by
four vias, two for Vcc and two for GND.
Physical Layout - B
Ground
For Signal Filtering, the in and out lines need to be
separated on the circuit board.
Vcc
Vcc
Ground
2
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